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1/22 datashee t tsz02201-0rar1g200040-1-2 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 14 001 13.sep.2013 rev.001 operational amplifiers low noise operational amplifiers ba8522rxxx general description ba8522rxxx are low noise operational amplifiers of high voltage gain. it excels especially in input referred noise voltage (9 hz nv/ ), total harmonic distortion (0.002%) and operating voltage range (2v to 16v) and it is the most suitable operational amplifier with audio equipment. features ? high voltage gain ? low input referred noise voltage ? low total harmonic distortion ? low input offset voltage ? wide operating supply voltage ? wide operating temperature range application ? audio application ? consumer equipment ? active filter key specifications ? operating supply voltage (split supply): 2v to 16v ? temperature range: -40c to +105c ? input offset voltage: 1.5mv(max) ? slew rate: 3v/s(typ) ? total harmonic distortion: 0.002%(typ) ? input referred noise voltage: 9 hz nv/ (typ) packages w(typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm ssop-b8 3.00mm x 6.40mm x 1.35mm msop8 2.90mm x 4.00mm x 0.90mm simplified schematic product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays figure 1. simplified schematic (1 channel only) vcc vee -in +in out downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 2/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com pin configuration ba8522rf : sop8 ba8522rfv : ssop-b8 ba8522rfvm : msop8 pin no. pin name 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc package sop8 ssop-b8 msop8 ba8522rf ba8522rfv ba8522rfvm ordering information b a 8 5 2 2 r x x x - x x part number ba8522rxxx package f : sop8 fv : ssop-b8 fvm : msop8 packaging and forming specification e2: embossed tape and reel (sop8/ssop-b8) tr: embossed tape and reel (msop8) line-up t opr operating supply voltage (split supply) supply current (typ) slew rate (typ) package orderable part number -40c to +105c 2.0v to 16.0v 5.5ma 3v/s sop8 reel of 2500 ba8522rf-e2 ssop-b8 reel of 2500 ba8522rfv-e2 msop8 reel of 3000 BA8522RFVM-TR -+ + - ch1 ch2 8 1 23 4 5 6 7 out1 -in1 +in1 vee vcc out2 -in2 +in2 downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 3/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com absolute maximum ratings (t a =25c) parameter symbol ratings unit supply voltage vcc-vee +36 v power dissipation p d sop8 0.69 (note 1,4) w ssop-b8 0.62 (note 2,4) msop8 0.59 (note 3,4) differential input voltage (note 5) v id +36 v input common-mode voltage range v icm (vee-0.3) to vee+36 v input current (note 6) i i -10 ma operating supply voltage v opr 2 to 16 (+4 to +32) v output current i out 50 ma operating temperature t opr -40 to +105 c storage temperature t stg 55 to +150 c maximum junction temperature t jmax +150 c (note 1) to use at temperature above t a =25c reduce 5.5mw/c. (note 2) to use at temperature above t a =25c reduce 5.0mw/c. (note 3) to use at temperature above t a =25c reduce 4.7mw/c. (note 4) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 5) the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. (note 6) excessive input current will flow if a differential input voltage in excess of approximately 0.6v is applied between the input unless some limiting resistance is used. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as ad ding a fuse, in case the ic is operated over the absolute maximum ratings. downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 4/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com electrical characteristics ba8522rxxx ( unless otherwise specified vcc=+15v, vee=-15v, t a =25c) parameter symbol limits unit condition min typ max input offset voltage (note 7) v io - 0.1 1.5 mv - input offset voltage drift (note 7) v io / t - 2 - v/c - input offset current (note 7) i io - 5 200 na - input bias current (note 8) i b - 50 500 na - supply current i cc - 5.5 9 ma r l = , all op-amps, +in=0v maximum output voltage v om 12 13.5 - v r l R 10k ? 10.5 11 - v r l R 2k ? large signal voltage gain a v 86 110 - db r l R 10k ? , out= 10v input common-mode voltage range v icm 12 14 - v - common-mode rejection ratio cmrr 70 90 - db - power supply rejection ratio psrr 76.5 90 - db - channel separation cs - 105 - db a v =40db, f=1khz out=1vrms slew rate sr - 3 - v/ s r l =2k ? , c l =100pf gain bandwidth gbw - 6 - mhz f=500khz input referred noise voltage v n - 1.2 - vrms a v =40db, r s =100 ? din-audio - 9 - hz nv/ a v =40db, r s =100 ? , f=1khz total harmonic distortion + noise thd+n - 0.002 - % a v =20db, out=5vrms f=1khz, 80khz-lpf channel separation cs - 100 - db out=0.5vrms, f=1khz a v =40db, input referred (note 7) absolute value (note 8) current direction: since first input stage is compos ed with pnp transistor, input bias current flows out of ic. downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 5/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com description of electrical characteristics described below are descriptions of the rele vant electrical terms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning ma y differ from those on another manufacturers document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cau se deterioration of characteristics. (1) supply voltage (vcc/vee) indicates the maximum voltage that can be applied between the positive vcc terminal and vee terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied betw een non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratin gs does not assure normal operation of ic. for normal operation, use the ic within the input co mmon-mode voltage range characteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic when mo unted on a specific board at the ambient temperature 25c (normal temperature). as for package product, p d is determined by the temperature t hat can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics item (1) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. (2) input offset voltage drift ( v io / t) denotes the ratio of the input offset voltage fluc tuation to the ambient te mperature fluctuation. (3) input offset current (i io ) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. (4) input bias current (i b ) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (5) supply current (i cc ) indicates the current that flows within the ic under specified no-load conditions. (6) output saturation voltage (v om ) signifies the voltage range that can be out put under specific output conditions. (7) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. a v = (output voltage) / (differential input voltage) (8) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (9) common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset voltage when the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) (10) power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volta ge)/(input offset fluctuation) (11) channel separation (cs) indicates the fluctuation in the output vo ltage of the driven channel with reference to the change of output voltage of the channel which is not driven. (12) slew rate (sr) indicates the ratio of the change in output voltage wi th time when a step input signal is applied. (13) gain bandwidth (gbw) the product of the open-loop voltage gai n and the frequency at which the voltage gain decreases 6db/octave. (14) input referred noise voltage (v n ) indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 6/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com (15) total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel. downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 7/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com 0 5 10 15 20 25 30 0.1 1 10 load resistance [k ? ] maximum output voltage swing [v p-p ] typical performance curves ba8522rxxx (*) the above data is measurement value of typical sample, it is not guaranteed. figure 3. su pp l y current vs su pp l y volta g e 25c 105c -40c 0 2 4 6 8 10 0 5 10 15 20 25 30 35 supply voltage [v] supply current [ma] ba8522rf ba8522rfv ba8522rfvm 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] . power dissipation [w] figure 2. power dissipation vs ambient temperature (derating curve) figure 5. maximum output voltage swing vs load resistance (vcc/vee=+15v/-15v, t a =25c) figure 4. supply current vs ambient temperature 2 v 15v 7.5 v 0 2 4 6 8 10 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [ma] downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 8/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com -20 -15 -10 -5 0 5 10 15 20 0.1 1 10 load resistance [k ? ] maximum output voltage [v] -10 -5 0 5 10 0 2 4 6 8 10 supply voltage [v] maximum output voltage [v] -20 -15 -10 -5 0 5 10 15 20 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage [v] -20 -15 -10 -5 0 5 10 15 20 0 5 10 15 20 25 output current [ma] maximum output voltage [v] typical performance curves - continued ba8522rxxx (*) the above data is measurement value of typical sample, it is not guaranteed. figure 6. maximum output voltage vs load resistance (vcc/vee=+15v/-15v, t a =25c) figure 7. maximum output voltage vs supply voltage (r l =2k ? , t a =25c) figure 8. maximum output voltage vs ambient temperature (vcc/vee=+15v/-15v, r l =2k ? ) figure 9. maximum output voltage vs output current (vcc/vee=+15v/-15v, t a =25c) v oh v ol v oh v ol v oh v ol v ol v oh downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 9/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com -6 -4 -2 0 2 4 6 0 2 4 6 8 10 12 14 16 supply voltage [v] input offset voltage [mv] 0 20 40 60 80 100 -50 -25 0 25 50 75 100 125 ambient temperature [c] input bias current [na] 0 20 40 60 80 100 0 2 4 6 8 10 12 14 16 supply voltage [v] input bias current [na] typical performance curves - continued ba8522rxxx (*) the above data is measurement value of typical sample, it is not guaranteed. figure 10. input offset voltage vs supply voltage (v icm =0v, e k =0v) -40 105 25 figure 11. input offset voltage vs ambient temperature (v icm =0v, e k =0v) figure 12. input bias current vs supply voltage (v icm =0v, e k =0v) figure 13. input bias current vs ambient temperature (v icm =0v, e k =0v) 15v 7.5v 2v -6 -4 -2 0 2 4 6 - 5 0- 2 50 2 55 07 51 0 01 2 5 ambient temperature [c] input offset voltage [mv] 2v 7.5v 15v -40c 25c 105c downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 10/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] -30 -20 -10 0 10 20 30 0 2 4 6 8 10 12 14 16 supply voltage [v] input offset current [na] typical performance curves - continued ba8522rxxx (*) the above data is measurement value of typical sample, it is not guaranteed. -5 -4 -3 -2 -1 0 1 2 3 4 5 -15 -10 -5 0 5 10 15 common mode input voltage [v] input offset voltage [mv] 105c 25c -40c figure 15. input offset current vs ambient temperature (v icm =0v, e k =0v) -30 -20 -10 0 10 20 30 -50-25 0 25 50 75100125 ambient temperature [c] input offset current [na] 2v 15v 7.5v figure 14. input offset current vs supply voltage (v icm =0v, e k =0v) figure 16. input offset voltage vs common mode input voltage (vcc=8v, e k =-4v) figure 17. common mode rejection ratio vs ambient temperature (vcc/vee=+15v/-15v, v icm =-12v to +12v) 105c -40c 25c downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 11/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com 0 20 40 60 80 1 10 100 1000 10000 frequency [hz] equivalent input noise voltage [nv/ hz] 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] typical performance curves - continued ba8522rxxx (*) the above data is measurement value of typical sample, it is not guaranteed. 0 1 2 3 4 5 0 2 4 6 8 10 12 14 16 supply voltage [v] slew rate [v/s] figure 19. slew rate vs supply voltage (c l =100pf, r l =2k ? , t a =25c) figure 20. equivalent input noise voltage vs frequency (vcc/vee=+15v/-15v, r s =100 ? , t a =25c) figure 18. power supply rejection ratio vs ambient temperature (vcc/vee=+2v/-2v to +15v/-15v) figure 21. total harmonic distortion vs output voltage (vcc/vee=+15v/-15v, a v =20db r l =2k ? , 80khz-lpf, t a =25c) 0.0001 0.001 0.01 0.1 1 0.1 1 10 output voltage [vrm s ] total harmonic distortion [%] 20khz 20hz 1khz 1 10 10 2 10 3 10 4 frequency [hz] downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 12/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com figure 23. voltage gain ? phase vs frequency (vcc/vee=+15v/-15v, a v =40db, r l =2k ? , t a =25c) 0 10 20 30 40 50 60 0.1 1 10 100 1000 10000 frequency : f [khz] voltage gain [db] 0 30 60 90 120 150 180 phase [deg] gain phase typical performance curves - continued ba8522rxxx (*) the above data is measurement value of typical sample, it is not guaranteed. 0 5 10 15 20 25 30 1 10 100 1000 frequency [khz] maximu m outpu t voltage swing [v p-p ] figure 22. maximum output voltage swing vs frequency (vcc/vee=+15v/-15v, r l =2k ? , t a =25c) 10 2 10 3 10 4 10 5 10 6 10 7 frequency [hz] downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 13/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com application information null method condition for test circuit 1 vcc, vee, e k , v icm unit: v parameter v f sw1 sw2 sw3 vcc vee e k v icm calculation input offset voltage v f1 on on off 15 -15 0 0 1 input offset current v f2 off off off 15 -15 0 0 2 input bias current v f3 off on off 15 -15 0 0 3 v f4 on off large signal voltage gain v f5 on on on 15 -15 10 0 4 v f6 15 -15 -10 0 common-mode rejection ratio (input common-mode voltage range) v f7 on on off 15 -15 0 -12 5 v f8 15 -15 0 12 power supply rejection ratio v f9 on on off 2 -2 0 0 6 v f10 16 -16 0 0 - calculation - 1. input offset voltage (v io ) 2. input offset current (i io ) 3. input bias current (i b ) 4. large signal voltage gain (a v ) 5. common-mode rejection ration (cmrr) 6. power supply rejection ratio (psrr) figure 24. test circuit1 (one channel only) |v f8 - v f7 | cmrr = 20log ? v icm (1+r f /r s ) [db] a v = 20log |v f6 - v f5 | ? e k (1+r f /r s ) [db] psrr = 20log |v f10 - v f9 | ? vcc (1+ r f /r s ) [db] v io = 1 + r f /r s [v] |v f1 | i io = r i x (1 + r f /r s ) [a] |v f2 - v f1 | i b = 2 x r i x (1 + r f /r s ) [a] |v f4 - v f3 | v icm r s =50 ? r s =50 ? r f =50k ? r i =10k ? r i =10k ? sw1 sw2 50k ? sw3 r l 0.1 f e k 500k ? 500k ? 1000pf v f 0.1 f 15v -15v vcc vee vo v null dut downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 14/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw 6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off off on off on off off off off off off maximum output voltage off off on off off off on off on off off on slew rate off off off on off off off on on on off off gain bandwidth off on off o ff on on off off on on on off input referred noise voltage on off off off on on off off off off on off figure 26. slew rate input waveform figure 27. test circuit 3(channel separation) figure 25. test circuit 2 (each channel) c vh vl input wave t input voltage vh vl t v output wave sr v/ t t output voltage 90% 10% vcc vee r2=100k ? r1=1k ? vcc vee out1 =0.5vrms v in out2 r1//r2 r1//r2 r1=1k ? r2=100k ? out2 cs = 20log 100 out1 sw1 sw2 sw3 sw10 sw11 -in +in r l vcc vee sw9 sw6 sw7 sw8 c l sw12 r s sw5 sw4 r1 r2 downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 15/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capabilit y). maximum junction temperature is typically equal to the maximum storage temperature. the heat gener ated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. therma l resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 28(a) shows the model of the ther mal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax t a ) / p d c/w the derating curve in figure 28(b) indicates the power that t he ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certai n temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumpti on, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the sa me of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 28(c) shows an example of the derating curve for ba8522rxxx. (note 9) (note 10) (note 11) unit 5.5 5.0 4.7 mw/c when using the unit above t a =25c, subtract the value above per degreec. permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (copper foil area less than 3%) is mounted. (c)ba8522rxxx figure 28. thermal resistance and derating curve ja =(t jmax -t a )/ p d c/w a mbient temperature t a [ c ] chip surface temperature t j [ c ] (a) thermal resistance (b) derating curve ambient temperature t a [ c ] power dissipation of lsi [w] p d ( max ) ja2 < ja1 ja1 ja1 t jmax 0 50 75 100 125 150 25 p1 p2 t jmax ja2 ja2 ba8522rf (note 9) ba8522rfv (note 10) ba8522rfvm (note 11) 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] . power dissipation [w] downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 16/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com examples of circuit voltage follower inverting amplifier non-inverting amplifier figure 30. inverting amplifier circuit figure 31. non-inverting amplifier circuit figure 29. voltage follower circuit voltage gain is 0db. using this circuit, the output voltage (out) is configured to be equal to the input voltage (in). this circuit also stabilizes the output voltage (out) due to high input impedance and low output im pedance. computation for output voltage (out) is shown below. out=in for inverting amplifier, input voltage (in) is amplified by a voltage gain and depends on the ratio of r1 and r2. the out-of-phase output voltage is shown in the next expression out=-(r2/r1) ? in this circuit has input impedance equal to r1. for non-inverting amplifier, input voltage (in) is amplified by a voltage gain, which depends on the ratio of r1 and r2. the output voltage (out) is in-phase with the input voltage (in) and is shown in the next expression. out=(1 + r2/r1) ? in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. out vee in vcc r2 r1 vee in out vcc r1//r2 vee r2 vdd in out r1 downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 17/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properti es of the chip. the absolute maximum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarantee d under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consider ation to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure 32): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 18/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com operational notes C continued parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 32. example of monolithic ic structure 12. unused circuits when there are unused op-amps, it is recommended that they are connected as in figure 33, setting the non-inverting input terminal to a potential within the in-phase input voltage range (v icm ). 13. input voltage applying vee +36v to the input terminal is possible without causing deterioration of the electrical char acteristics or destruction, regardless of the supply voltage. however, th is does not ensure normal circuit operation. please note that the circ uit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 14. power supply(single/dual) the op-amp operates when the volt age supplied is between vcc and vee. therefore, the single supply op-amp can be used as dual supply op-amp as well. 15. output capacitor if a large capacitor is connected between the output pin and vee pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the vcc pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0.1uf between output pin and vee pin. 16. oscillation by output capacitor please pay attention to the oscillation by output capacito r and in designing an applicat ion of negative feedback loop circuit with these ics. 17. short-circuit of output terminal when output terminal and vcc or vee terminal are shor ted, excessive output current may flow under some conditions, and heating may destroy ic. it is necessary to connect a resistor as show n in figure 34. , thereby protecting against load shorting. vdd keep this potential in v icm v icm - + vss figure 33. example of application circuit for unused op-amp protection resistor figure 34. the example of output short protection vee vcc downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 19/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com physical dimensions tape and reel information package name sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 20/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com physical dimension, tape and reel information C continued package name ssop-b8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 21/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com physical dimension, tape and reel information C continued package name msop8 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet tsz02201-0rar1g200040-1-2 22/22 13.sep.2013 rev.001 tsz22111 ? 15 ? 00 ba8522rxxx ? 2013 rohm co., ltd. all rights reserved. www.rohm.com marking diagrams land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 sop8 1.27 4.60 1.10 0.76 ssop-b8 0.65 4.60 1.20 0.35 msop8 0.65 2.62 0.99 0.35 revision history date revision changes 13.sep.2013 001 new release product name package type marking ba8522r f sop8 8522r fv ssop-b8 fvm msop8 sop8(top view) part number marking lot number 1pin mark ssop-b8(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark sop8, ssop-b8, msop8 mie ? 2 b 2 e downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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